Virgin BASF Polyamide 6/66 Copolymer Ultramid C33 LC Granules In Stock 

BASF Ultramid® C37LC is used in shrink film for food packaging application and monofilament applications.Ultramid® C37LC by BASF is a blend of polyamide 6 and polyamide 6.6 (PA 6/6.6) grade. Exhibits low crystallinity, good softness and is more transparent than films made of conventional copolyamide. Provides higher hot water and hot air shrinkage. 

Ultramid® polyamide grades are available in various molecular weights or viscosities, have a range of additives and can be reinforced with glass fibers or minerals. More detailed information on the individual products can be found in the Ultramid® product range.

Ultramid® A in its unreinforced state, is an extremely rigid, abrasion-resistant, heat-resistant and hard material. It is one of the preferred materials for parts subject to mechanical and thermal stresses in electrical, mechanical and automotive engineering.

Ultramid® B, in its unreinforced state, is a tough, hard material affording parts with good damping characteristics and high shock resistance even in a dry state and at low temperatures. It is particularly tough and easy to process.Translucent products are also available under the name Ultramid® Vision. 

Ultramid® C are grades of co-polyamides made from PA6 or PA66 monomers that exhibit different melting points or a lower crystallinity according to their composition.

Ultramid® D are blends of PA6 and PA66 and other polyamides with customized properties, available as unreinforced grades (e.g., Ultramid® Deep Gloss D3K) and reinforced grades (e.g. Ultramid® Endure D3G7 BK20560).

Ultramid® S Balance, mostly made from natural resources, is particularly chemical resistant and known for its low moisture absorption. Ultramid® S Balance is for applications where components come in contact with media.

Ultramid Expand®, a particle foam based on a combination of several polyamide 6 grades, consists of pre-foamed particles with defined particle size and density, which makes it ideal for welding 3D components without generating foam waste in a molding machine.